T9+ Platinum Thermal Paste

Alseye T9+ Platinum, for your high-end gaming devices !!!

• Non-curing materials

• High thermal conductivity

• Able to achieve very thin bond line thickness

• Low thermal resistance

• Thixotropic, low slump

• Low volatile

Outstanding Thermal Management

T9+ Platinum is formulated with thermally conductive filler particles and optimized silicone polymers to improve performance and reliability.

T9+ Platinum Thermal Conductivity

Conductive filler particles and optimized silicone polymers create an uninterrupted, thermally conductive path between the CPU & heatsink.

Long-term Material Stability

T9+ Platinum stays strong over the full operating cycle of your gaming hardware, exhibiting minimal evaporation over a wide operating temperature range----even in a vacuum atmosphere (10-5 tor/mil, 24hrs@100℃).

Alseye T9+ Platinum For top builds and high-end setups

Offering a high thermal conductivity of 13.5 W/mK and the ability to achieve a very thin bond line thickness of approximately 18 um, the Thermally Conductive Compound yields a low thermal resistance of 0.038℃-cm²/ W