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T9+ Platinum Thermal Grease Kit
Alseye T9+
Platinum, for your high-end gaming devices !!!
- Non-curing
materials
- High thermal
conductivity
- Able to achieve
very thin bond line thickness
- Low thermal
resistance
- Thixotropic, low
slump
- Low volatile
Outstanding Thermal Management
T9+ Platinum is
formulated with thermally conductive filler particles and optimized silicone
polymers to improve performance and reliability.
T9+ Platinum Thermal Conductivity
Conductive filler
particles and optimized silicone polymers create an uninterrupted, thermally conductive path between the CPU & heatsink.
Long-term Material Stability
T9+ Platinum stays
strong over the full operating cycle of your gaming hardware, exhibiting
minimal evaporation over a wide operating temperature range----even in a vacuum
atmosphere (10-5 tor/mil, 24hrs@100℃).
Alseye T9+ Platinum For top builds and high-end setups
Offering a high
thermal conductivity of 13.5 W/mK and the ability to achieve a very thin bond
line thickness of approximately 18 um, the Thermally Conductive Compound yields a low
thermal resistance of 0.038℃-cm²/ W
Specification | |
Color | Gray |
Electrical
Conductivity | No |
Volume | 5g |
One
Part Material | Non-curing |
Viscosity
at Low Strain Rate | 1,200
Pa-s |
Viscosity
at High Strain Rate | 100
Pa-s |
Specific
Gravity | 2.6 |
Volatile
Content, 48 hours at 125°C | 0.02% |
Thermal
Conductivity | 13.5W/m-K |
Thermal
Resistance at 25 N/cm² | 0.04 ℃-cm²/ W |
Bond
Line Thickness at 25 N/cm² | 0.02 mm
(0.0008 in) |
Note* | Price,
feature and specifications are subject to change without notice. |





