MASTERGEL PRO

MasterGel Pro thermal gel goes a step above in thermal dissipation for advanced users. Polymer oxides in the compound create high conductivity between the C.P.U and cooler base to transfer heat quickly.

The powerful formula is still easily applied and removed without damaging the base.

High C.P.U/G.P.U conductivity (8 W/m.k)

Improves heat transfer from chipset to cooler base or heatpipes

Easy to spread and remove without surface damage